XC7Z035-3FBG676E
XC7Z035-3FBG676E
XC7Z035-3FBG676E
XC7Z035-3FBG676E
  • Embedded - System On Chip (SoC) XC7Z035-3FBG676E
  • Embedded - System On Chip (SoC) XC7Z035-3FBG676E
  • Embedded - System On Chip (SoC) XC7Z035-3FBG676E
  • Embedded - System On Chip (SoC) XC7Z035-3FBG676E
XC7Z035-3FBG676E
Category
Embedded - System On Chip (SoC)
Manufacturer
AMD Xilinx
RoHS
YES
Certification
ISO14001:2015 Certification ISO 45001:2018 Certification ISO 9001:2015 Certification
Delivery
Delivery
Payment
Payment

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Specifications
Data Sheet
TYPEDESCRIPTION
Part Number:XC7Z035-3FBG676E
Description:IC SOC CORTEX-A9 KINTEX7 676BGA
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Manufacturer Standard Lead Time10 Weeks
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Operating Temperature0°C ~ 100°C (TJ)
RAM Size256KB
Meta Part NumberXC7Z035-3FBG676E-ND
Speed800MHz
PeripheralsDMA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
PackagingTray
ArchitectureMCU, FPGA
Primary AttributesKintex™-7 FPGA, 275K Logic Cells
Package / Case676-BBGA, FCBGA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Supplier Device Package676-FCBGA (27x27)
Moisture Sensitivity Level (MSL)3 (168 Hours)
Flash Size-
Detailed DescriptionDual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 256KB 800MHz 676-FCBGA (27x27)
SeriesZynq®-7000
Number of I/O130

Data sheet: Work in prgress, stay tuned!

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