Quality control

Integrated quality and environmental management system

The starting point for all ANDE Electronic activities is to meet the requirements and expectations of customers, business partners, employees and other stakeholders. To this end, ANDE Electronic pursues a policy of sustainable development and establishes a conscious and good relationship between economic growth, environmental protection and human health.


Our ISO-9001 quality management system certificate can prove:It provides companies with the necessary details to define an international standard for acceptable quality management systems to provide direction on what to include in their processes.


High quality is a value that is important to ANDE Electronic, not only related to the products provided, but also to the level of service provided. We also attach great importance to the quality inspection process of electronic components:


1.Receiving inspection

Ande receives the components and perform preliminary inspection and verification on them. Here are the specific steps:

1. Purchase order number and shipping box condition inspection

a. Number of boxes/quantity confirmation

b. Part number verification

c. MR (material receipt) creation

d. Tracking number record

e. Packaging condition inspection

f. Verification check


2. Verify and inspect the important information of electronic components to ensure that they meet the requirements. Specifically include:

a. Manufacturer part number confirmation

b. Manufacturer verification

c. Date code check

d. Batch number/serial number verification

e. Quantity verification

f. Origin confirmation

g. Humidity sensitivity level inspection

h. Verification of packaging conditions

i. Confirmation of customer requirements/special shipping instructions

J.Quality inspection


3. Detailed inspection and documentation to ensure components meet quality standards. Specifically include:

a. Label check

b. Data table verification

c. Packaging size confirmation

d. General visual inspection

e. Detailed visual inspection (marking, body, leads, etc.)

f. Marking durability test

g. Acetone swab test

h.XRF Lead Finish Assessment

i.X-ray test

J. Scratch test

k. Capacitance, resistance and inductance testing


4. We will conduct quality inspection and value-added testing before shipment to ensure the reliability of components. include:


Visual inspection to verify parts are original, new and unused.

High magnification inspection of mark permanence and solvent resistance, resurfacing, dimensional verification, mark code matching, body and terminal condition are standard methods in our inspection process.All inspections and observations are reviewed by our quality engineers to evaluate whether we have discovered new counterfeiting techniques or manufacturing anomalies.



Packaging exposes the chip in any plastic IC package by etching away the chip's plastic covering. This process will allow us to see if there is actually a chip inside the package. DECAP will also display die topography, manufacturer markings, copyright dates, part numbers, die size consistency across date codes, and bond wires.



Test whether the voltage, current, resistance, capacitance, etc. of the input, output and power pins of electronic equipment are reasonable.



X-ray inspection is an internal component inspection based on images obtained through an X-ray machine, which will be an inspection of internal shorts/opens in the component being tested.



To test if the component is blank. Non-programming and its usability. Mainly used in OTP. EPROM and EEPROM etc. The storage type for component tests.



Solderability is a test used to determine if a contract manufacturer's components will have soldering problems. This will result in the component not being soldered to the board.